So I was thinking...(run away!)
After reading several boards, and web sites, other people which are smarter than me have ascertained that the the existing tape/quarter/shim fix is that it doesn't really help the situation much. If you apply pressure uniformly (tape/shim) or just in the center (quarter), you're not applying pressure to where it needs to go. The problem joints are at the edges or corners of the BGA/GPU where the board flexes the most.
Using any of those methods doesn't really help those joints.
DISCLAIMER:
I assume no responsability or liability for following these instructions. This is what I tried, it sort of worked, so I'm sharing it. Any modifications you make to your hardware are on you.
So, here's what I tried:
- Disassemble your iBook
- Once you have the processing shield removed, peel up the clear plastic square cutout from around the GPU
- Gently and I do mean gently! cut and peel back about 1/8th of an inch of the thermal pad material all the way around the GPU
- Corner up the plastic square cutout on the top left corner
- Mark and cut the top right and bottom left corners into two pieces that will fit on the edge of the GPU
- Now peel up the double adhesive tape sections that originally held the clear plastic cut out down
- Attach the tape slices to each edge of the GPU, being careful not to overlap the ends!
- Press the two pieces of plastic cut out onto the adhesive tape and set them in place.
- Re-attach the processor shield
- Apply a square shim over the GPU square indentation on the processor shield
- Re-assemble the laptop and test
- Hopefully it works, it did for me at least for a little while after a few false starts.
Good luck
